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Structure of single-sided flex : Cover Layer, Copper, Base, Stiffener

Stucture of Double-sided flex: cover layer, copper, base, copper, copper plating, cover layer, stiffener.

The advantages of Printed Circuit Board£º
Provides a uniform electrical characteristic for high speed circuiting
Flexable for easy installation
Good insulation
Reduce space
Dynamic flexing requirements
Light weight

Quality control of Print Circuit Board :
Quality is our companies 'life. To implementation the quality policy. The company has established a quality system is avoidance with the requirements of ISO9001:2000. To assurance the products performance. We are certified according to UL and IPC. To guarantee our customers' benefit, We formulated integrity quality system to manage our quality process and it complies with international quality standard, for instance, from raw materiel sourcing to finish well,from incoming quality checking to customer satisfaction and from product prototype to manufacturing process control.

 
   
   
   
   
     
  Application£º  
 
 
     
  Main technique index£º  
 
Description
Parameters
Polyimide
Polyester
Base Thickness(µ m)
12.5,25,35,50
12.5,25,35,50
Copper Thickness(µ m)
12,17.5,35,50,70,105
Min Line Width/Line Space(mm)
0.075/0.075
Min Hole Size(mm)
0.25
Tolerance(mm)
(Outline)¡À0.05/(Coverlayer)¡À0.2
Peel Strength(Kgf/cm)
Above 1.0
Above 0.8
Solder Resistance
260°C 10(Sceconds)
204°C 5(Sceconds)
 
     
 
Surface Finishing
Thickness
Hot Air Leveling(H.A.L.)
5-20µ m
Entek/O.S.P
Tin/Lead plating
3-5µ m
Ni/Au Plating
Ni:2-5µ m AU:0.02-0.1µ m
Immersion Gold
Ni:3-5µ m AU:0.03-0.1µ m
Immersion Tin
Tin plating
3-5µ m
 
     
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